High Density Interconnect

High Density Interconnect (HDI) attributes are printed circuit board designs that employ increased feature density to achieve lighter weight, reduced layer count, and thinner stack ups.

HDI design configurations allow multi-track routing of high I/O, fine pitch devices 0.5 mm and below. Isola is an industry leader in resin system development and has designed several resin systems and construction sets that enable consistent, reliable production of HDI printed circuit board products.  Our high performance products, such as 370HR, provide the thermally robust performance required for sequential lamination cycles of these complex structures. In addition, we utilize spread glass technology and incorporate square weave constructions whenever possible.  These advanced glass technologies improve laser ablation consistency, critical feature registration, and dielectric thickness control.  We offer our ultrathin glass fabrics for many of our high performance products.

Features

Overview

  • Multiple resin systems – High Tg, lead-free, high speed digital, RF, halogen-free
  • Hybrid capability
  • Wide range of RC% prepregs
  • Ultrathin glass styles  – 1027, 1035, 1078, 1067, 1086
  • Square weave and spread glass
  • Ultrathin glass reinforced laminate down to 0.04 mm or 1 mil

Typical Applications

  • Servers
  • Personal Electronics
  • Military and Aerospace
  • Layer Count Reduction
  • Sequential Lamination

Markets

Related Materials From Isola

185HR
Tg: 180°C
Td: 340°C
Dk: 4.01
Df: 0.0200
Markets
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Tachyon® 100G
Tg: 200°C
Td: 360°C
Dk: 3.02
Df: 0.0021
Markets
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I-Tera® MT40
Tg: 200°C
Td: 360°C
Dk: 3.45
Df: 0.0031
Markets
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I-Speed®
Tg: 180°C
Td: 360°C
Dk: 3.64
Df: 0.0060
Markets
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FR408HR
Tg: 190°C
Td: 360°C
Dk: 3.68
Df: 0.0092
Markets
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IS415
Tg: 200°C
Td: 370°C
Dk: 3.72
Df: 0.0120
Markets
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370HR
Tg: 180°C
Td: 340°C
Dk: 4.04
Df: 0.0210
Markets
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Resources

Control of Key Registration Variables for Improved Process Yields on Dense MLBs

This paper explains the sources of registration error and outlines a path for improving process yield.

Coated Copper Foils for High Density Interconnects

This paper discusses laser and plasma ablatable dielectric materials, available as coatings on copper.

ICDs (InterConnect Defects) What are they? Where do they come from? How can we make them go away?

This presentation describes smeared resin, hole debris and post separation ICDs.

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Laminates, Prepreg, & PCB Materials
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